JPH0526765Y2 - - Google Patents
Info
- Publication number
- JPH0526765Y2 JPH0526765Y2 JP16279687U JP16279687U JPH0526765Y2 JP H0526765 Y2 JPH0526765 Y2 JP H0526765Y2 JP 16279687 U JP16279687 U JP 16279687U JP 16279687 U JP16279687 U JP 16279687U JP H0526765 Y2 JPH0526765 Y2 JP H0526765Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sealant
- resin
- edge
- clip lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16279687U JPH0526765Y2 (en]) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16279687U JPH0526765Y2 (en]) | 1987-10-23 | 1987-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0167763U JPH0167763U (en]) | 1989-05-01 |
JPH0526765Y2 true JPH0526765Y2 (en]) | 1993-07-07 |
Family
ID=31446949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16279687U Expired - Lifetime JPH0526765Y2 (en]) | 1987-10-23 | 1987-10-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0526765Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009277959A (ja) * | 2008-05-16 | 2009-11-26 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
-
1987
- 1987-10-23 JP JP16279687U patent/JPH0526765Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0167763U (en]) | 1989-05-01 |
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